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| Log emmc xiaomi |
Bus: 4 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x11 (Toshiba)
Product name: 032G74 (0x303332473734), rev: 0x00, serial number: 0xF18F1799
Manufacturing date: Oct2019
CID: 11010030 33324737 3400F18F 1799A2C4
CSD: D0270032 0F5903FF FFFFFFE7 8640009A
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 4 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6795, cpu abi: arm64-v8a
manufacturer: Xiaomi
board: hennessy, name: hennessy
brand: Xiaomi, model: Redmi Note 3
build id: LRX22G, version: lima.0.dua Lollipop (LRX22G)
build description: hennessy-user 5.0.2 LRX22G V7.0.19.0.0.lhncNCJ release-keys
Internal storage: 26.27 GiB
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