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How To Flash Firmware Using QPST Flash Tool Qualcomm Product Support Tools

How To Flash Firmware Using QPST Flash Tool Qualcomm Product Support Tools

  
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How To </p> <p>Additionally, a 403 Forbidden Using QPST </p> Too Product Support Tools)

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  • " button on the tool. Then there will be a flashing process on the toolwait for the process to complete. When finished then your Smarphone device will Reboot.
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Download QPST Flash Tool Qualcomm Product Support Tools

Download QPST Flash Tool Qualcomm Product Support Tools

  
Download QPST Flash Tool (Qualcomm Product Support Tools)

QPST Flash Tool (Qualcomm Product Support Tools) is a small device that lets in you to flash firmware on  Qualcomm Smartphone and Tablets.
Before Flash Firmware, you need a Qualcomm USB Driver mounted in your laptop, because QPST Flash Tool will now not hit upon your Smartphone device if Qualcomm USB Driver is not mounted. To installation Qualcomm USB Driver, you may try this through following step by step on put up Download and Install Android USB Driver (Any Device).
QPST Flash Tool is like minded with Windows XP, Windows Vista, Windows 7, Windows 8, Windows 8.1 and Windows 10.
To do Flash Firmware on a Qualcomm device, you could follow grade by grade on How To Flash Firmware Qualcomm Devices Using QPST Flash Tool.

The features owned through Qualcomm Product Support Tools are as follows:
Installer
QPST Flash Tool comes as a installer utility, because of this as a way to use the application you need to install it for your computer.

QPST Configuration
It permits you to display the popularity of active devices, available serial ports and energetic clients. QPST Configuration can be used on other QPST customers.

Service Programming
It allows you to save the service programming statistics to document and flash the same provider programming record on more than one gadgets.

Software Download
It lets in you to Flash inventory firmware (rom) on any Qualcomm telephone and Tablets. It additionally permits you to backup and repair nonvolatile (NV) memory contents.

RF Calibration
It allows you to get entry to the Qualcomm Device NV items which controls the RF utilization. This functions handiest works with SURF and FFA devices, it can now not work on other device fashions.

Inbuild QFIL Flash Tool
QPST Flash Tool comes with the inbuilt QFIL Flash Tool, which also lets in you to Flash Stock Firmware on Qualcomm telephone and Tablets.

To get Qualcomm Product Support Tool (QPST), you can down load them at the lowest of this:

Download QPST Flash Tool


QPST_2.7.104.zip
QPST_2.7.363.zip
QPST_2.7.366.zip
QPST_2.7.420.zip
QPST_2.7.422.zip
QPST_2.7.445.zip
QPST_2.7.447.zip
QPST_2.7.453.zip
QPST_2.7.460.zip

Support eMMC/eMCP Asus Zenfone 2 Laser ZE550KLZ00LD

  
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Support eMMC/eMCP Asus Zenfone 2 Laser ZE550KL-Z00LD
Log emmc asus

Log Support
Manufacturer ID: 0x13 (Micron)
Product name: R1J96N (0x52314a39364e), rev: 0x10, serial number: 0x5521D677
Manufacturing date: Aug2019
CID: 13014E52 314A3936 4E105521 D67782E8
CSD: D07F0132 0F5903FF FFFFFFEF 864000AC
EXT_CSD revision: 1.7 (MMC v5.0, v5.01) 
Partition berita:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled 
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID System Info:
platform: msm8916, cpu abi: arm64-v8a
manufacturer: asus
board: msm8916, name: WW_Z00L
brand: asus, contoh: ASUS_Z00LD
build id: LRX22G, version: lima.0.dua Lollipop (LRX22G.ww_user_1.17.40.1531_20160428)
build description: Z00L-user 5.0.dua LRX22G WW_user_1.17.40.1531_20160428 release-keys
Internal storage: 11.10 GiB
crypto state: unencrypted
Selected: [Micron] MT29TZZZ5D6YKFAH-125/16GB   (BGA221)
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Log Info Konfigurasi eMMC/eMCP Lenovo K33

  
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Log Info Konfigurasi eMMC/eMCP Lenovo K33
Log emmc lenovo
Log Support ic eMMC/eMCP Lenovo k33

VCC: tiga.tiga V, VCCQ: 2.8 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, dua.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RX1BMB (0x525831424d42), rev: 0x07, serial number: 0x75C2CC36
Manufacturing date: Sep2019
CID: 15010052 5831424D 420775C2 CC36932A
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC ) 
Capacity: 29.13 GiB(31,281,119,232 bytes)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled 
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

ANDROID ROM detected:
platform: msm8937, cpu abi: armeabi-v7a
manufacturer: LENOVO
board: QC_Reference_Phone, name: karate
brand: Lenovo, model: Lenovo K33
build id: MMB29M, version: 6.0.1 (K33_S156_170220_ROW)
build description: karate-user 6.0.1 MMB29M K33_S156_170220_ROW release-keys
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Selamat mencoba serta Semoga sukses

Log Info Konfigurasi eMMC/eMCP Samsung Galaxy J5 SMJ500G

  
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Log Info Konfigurasi eMMC/eMCP Samsung Galaxy J5 SM-J500G
Support emmc samsung j5
Manufacturer ID: 0x15 (Samsung)
Product name: QN16MB (0x514e31364d42), rev: 0x00, serial number: 0x24FCC269
Manufacturing date: Jun2019
CID: 15010051 4E31364D 420024FC C2696200
CSD: D0270132 0F5903FF F6DBFFEF 8E404000
EXT_CSD revision: 1.7 (MMC v5.0, v5.01) 
Capacity: 7.29 GiB(7,827,095,552 bytes)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 512 KiB
User area: 7.28 GiB(7,827,095,552 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled 
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

platform: msm8916, cpu abi: armeabi-v7a
manufacturer: samsung
hardware: qcom
board: MSM8916, name: j5ltedx
brand: samsung, model: SM-J500G
build id: MMB29M, version: 6.0.1 Marshmallow (MMB29M.J500GXXU1BQE1)
build date: Tue May  9 18:25:24 KST2019, security patch:2019-05-01
build description: j5ltedx-user 6.0.1 MMB29M J500GXXU1BQE1 release-keys
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Log Info Konfigurasi Emcp Asus ZenFone 2 Laser Z00RD ZE500KG

  
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Log Info Konfigurasi Emcp Asus ZenFone 2 Laser Z00RD ZE500KG
Log emmc asus
Product name: R311MB (0x523331314d42), rev: 0x01, serial number: 0x8424D01A
Manufacturing date: May2019
CID: 15010052 3331314D 42018424 D01A52A2
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Capacity: 14.57 GiB(15,646,851,072 bytes)
Partition isu:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID ROM detected:
platform: msm8916, cpu abi: arm64-v8a
manufacturer: asus
board: msm8916, name: WW_Phone
brand: asus, contoh: ASUS_Z00RD
build id: LRX22G, version: 5.0.2 (LRX22G.ww_Phone-12.8.lima.227-20160114)
build description: WW_Phone-user 5.0.dua LRX22G 12.8.5.227-20160114 release-keys
Log 2
VCC: tiga.tiga V, VCCQ: tiga.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, dua.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x07, serial number: 0xB9A13CF1
Manufacturing date: Jun2019
CID: 90014A48 38473165 0507B9A1 3CF1621A
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition isu:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID ROM informasi:
platform: msm8916, cpu abi: arm64-v8a
manufacturer: asus
board: msm8916, name: OPEN_Phone
brand: asus, contoh: ASUS_Z00RD
build id: LRX22G, version: 5.0.dua Lollipop (OPEN_Phone-userdebug 5.0.dua LRX22G 12.9.1.93-20151120-F test-keys)
build description: OPEN_Phone-userdebug 5.0.2 LRX22G 12.9.1.93-20151120-F test-keys
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Log Info Konfigurasi Emmc LG G3 D855

  
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Log Info Konfigurasi Emmc LG G3 (D855)
Log 1

VCC: tiga.3 V, VCCQ: dua.8 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x11 (Toshiba)
Product name: 032G74 (0x303332473734), rev: 0x00, serial number: 0xB490D9B2
Manufacturing date: May2019
CID: 11010030 33324737 3400B490 D9B252EA
CSD: D0270032 0F5903FF FFFFFFE7 8640009A
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 4 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID ROM isu:
platform: msm8974, cpu abi: armeabi-v7a
manufacturer: LGE
board: MSM8974, name: g3_global_com
brand: lge, model: LG-D855
build id: KVT49L.A1404196644, version: 4.4.dua KitKat (KVT49L.A1404196644)
build description: g3_global_com-user 4.4.2 KVT49L.A1404196644 1404196644 release-keys

Selected: [TOSHIBA] eSD THGBM5G8A4JBAIR/32GB  (FBGA153)
Log 2
Product name: VTU00M (0x56545530304d), rev: 0xFC, serial number: 0xDEF92707
Manufacturing date: Apr2019
CID: 15010056 54553030 4DFCDEF9 2707401E
CSD: D0270132 0F5903FF F6DBFFFF 8E40406C
EXT_CSD revision: 1.6 (MMC v4.5, v4.51)
Capacity: 14.69 GiB(15,770,583,040 bytes)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0xD0
Password protection features: disabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

ANDROID ROM detected:
platform: msm8974, cpu abi: armeabi-v7a
manufacturer: LGE
board: MSM8974, name: g3_global_com
brand: lge, model: LG-D855
build id: KVT49L.A1404196644, version: 4.4.dua (KVT49L.A1404196644)
build description: g3_global_com-user 4.4.2 KVT49L.A1404196644 1404196644 release-keys

Selected: [SAMSUNG] moviNAND KMVTU000LM-B503/16GB  (FBGA153)
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Log Info Konfigurasi eMMC/eMCP samsung galaxy j2 prime smg532g

  
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Log Info Konfigurasi eMMC/eMCP samsung galaxy j2 prime sm-g532g
Samsung
Product name: QN16BB (0x514e31364242), rev: 0x00, serial number: 0x71C068E0
Manufacturing date: Sep2019
CID: 15010051 4E313642 420071C0 68E094D6
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x50
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

Detected: SAMSUNG moviNAND KMQN10006B-BXXX/8G
Skhynix
Product name: H8G4u’ (0x483847347592), rev: 0x01, serial number: 0x28F004CD
Manufacturing date: Apr2019
CID: 90014A48 38473475 920128F0 04CD4434
CSD: D0270132 0F5903FF FFFFFFE7 8A40002A
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x50
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

ANDROID ROM informasi:
 platform: MT6737T, cpu abi: armeabi-v7a
 manufacturer: samsung
 board: MT6737T, name: grandppltedx
 brand: samsung, contoh: SM-G532G
 build id: MMB29T, version: 6.0.1 Marshmallow (MMB29T.G532GDXU1AQC1)
 build description: grandppltedx-user 6.0.1 MMB29T G532GDXU1AQC1 release-keys
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Log Info Konfigurasi eMMC/eMCP xiaomi Redmi 2 Prime/HM 2LteSA

  
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Log Info Konfigurasi eMMC/eMCP xiaomi Redmi 2 Prime/HM 2Lte-SA
Log emmc xiaomi
Log 1

Manufacturer ID: 0x90 (SK Hynix)
Product name: HAG2e (0x484147326505), rev: 0x07, serial number: 0xFF13D515
Manufacturing date: May2019
CID: 90014A48 41473265 0507FF13 D51552B2
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition berita:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,762,194,432 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x50
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
ANDROID ROM informasi:
platform: msm8916, cpu abi: armeabi-v7a
manufacturer: Xiaomi
board: msm8916, name: wt86047
brand: Xiaomi, model: wt86047
build id: LMY47V, version: 5.1.1 Lollipop (LMY47V)
build description: wt86047-user lima.1.1 LMY47V 6.4.14 release-keys

Selected: [HYNIX] eNAND H9TQ17ABJTMCUR-KUM/16GB+LPDDR3 16Gb  (BGA221)

Log 2
Manufacturer ID: 0x15 (Samsung)
Product name: QN1SMB (0x514e31534d42), rev: 0x01, serial number: 0x5117C0F2
Manufacturing date: Feb2019
CID: 15010051 4E31534D 42015117 C0F22200
CSD: D0270132 0F5903FF F6DBFFEF 8E404000
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Capacity: 7.29 GiB(7,827,095,552 bytes)
Partition berita:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 512 KiB
User area: 7.28 GiB(7,827,095,552 bytes)
Cache size: 64 MiB
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

platform: msm8916, cpu abi: armeabi-v7a
manufacturer: Xiaomi
hardware: qcom, version: P1
board: msm8916, name:2019817
brand: Xiaomi, model:2019817
build id: KTU84P, version: 4.4.4 Lollipop (KTU84P), mod: wt88047_global (MIUI7)
build date: Mon Jan 25 16:17:05 CST2019, security patch:2019-12-01
build description:2019811-user 4.4.4 KTU84P HM2014811 release-keys
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Log iNFO Konfigurasi eMMC/eMCP Oppo A37F

  
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Log iNFO Konfigurasi eMMC/eMCP Oppo A37F
Product name: Q823MB (0x513832334d42), rev: 0x00, serial number: 0x41D1901D
Manufacturing date: Agust2019
CID: 15010051 3832334D 420041D1 901D83E4
CSD: D0270132 0F5903FF F6DBFFEF 92404008
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
Internal storage: 10.75 GiB
crypto state: unencrypted

ANDROID System Info:
platform: msm8916, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8916, name: A37f
brand: OPPO, contoh: A37f
build id: LMY47V, version: 5.1.1 Lollipop (A37fEX_11_160523)
build description: msm8916_64-user lima.1.1 LMY47V eng.root.20160523.202506 release-keys
  • Log ini kami ambil dari UFIBOX Dengan adanya ini gampang-mudahan mampu membantu mitra-kawan yang ingin melakukan pergantian ic emmc/emcp sanggup menjadi lebih gampang.bantu share apabila artikel ini bermanfaat Terima Kasih.
Untuk jenis emmc yang mendukung lainya,mampu menuju kemari
File emmc mampu pada ambil pada bawah ini
Sekian dari kami,log support ic emmc dalam oppo a37f,Semoga sukses

Log Info Konfigurasi eMMC/eMCP Samsung Galaxy Tab 3 10.1 P5220

  
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Log Info Konfigurasi eMMC/eMCP Samsung Galaxy Tab 3 10.1 P5220
Log emmc samsung
Product name: V2W00M (0x56325730304d), rev: 0x00, serial number: 0x836F269B
Manufacturing date: Mar2019
CID: 15010056 32573030 4D00836F 269B3000
CSD: D0270132 0F5903FF F6DBFFEF 8E404000
EXT_CSD revision: 1.7 (MMC v5.0, v5.01) 
Capacity: 29.12 GiB(31,269,060,608 bytes)
Partition isu:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 512 KiB
User area: 29.11 GiB(31,269,060,608 bytes)
GP1: 8 MiB
Cache size: 64 MiB
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x10
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
User area write protection: 0x80
Password protection features: disabled
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

platform: clovertrail, cpu abi: x86
manufacturer: samsung
hardware: santos10lte
board: clovertrail, name: santos10ltexx
brand: samsung, model: GT-P5220
build id: KOT49H, version: 4.4.dua Lollipop (KOT49H.P5220XXUBNL2)
build date: Wed Dec 17 20:30:27 KST2019
build description: santos10ltexx-user 4.4.dua KOT49H P5220XXUBNL2 release-keys
  • Log di ambil dari UFIBOX Dengan adanya ini gampang-mudahan bisa membantu kawan-kawan yg ingin melakukan pergantian ic emmc/emcp bisa menjadi lebih gampang.bantu share bila artikel ini berguna Terima Kasih.
Untuk support emmc lainya sanggup menuju kemari Support ic emmc all merk,file arsip dumpnya bisa pada unduh di sini,File dump emmc samsung update

Log Info Konfigurasi eMMC/eMCP Samsung Galaxy J Docomo SC02F

  
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Log Info Konfigurasi eMMC/eMCP Samsung Galaxy J Docomo SC-02F
Log emmc samsung sc-02f
Manufacturer ID: 0x11 (Toshiba)
Product name: 032G92 (0x303332473932), rev: 0xB0, serial number: 0x5A6205B7
Manufacturing date: May2019
CID: 11010030 33324739 32B05A62 05B75000
CSD: D00E0032 0F5903FF FFFFFFFF 92400000
EXT_CSD revision: 1.6 (MMC v4.5, v4.51) 
Capacity: 29.13 GiB(31,277,449,216 bytes)
Partition berita:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 512 KiB
User area: 29.12 GiB(31,277,449,216 bytes)
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x03
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

platform: msm8974, cpu abi: armeabi-v7a
manufacturer: samsung
hardware: qcom
board: MSM8974, name: SC-02F
brand: samsung, model: SC-02F
build id: LRX21V, version: 5.0 Lollipop (LRX21V.sc02FOMSGPL2)
build date: Fri Dec  9 10:56:20 KST2019
build description: hltejs01dcm-user 5.0 LRX21V SC02FOMSGPL2 release-keys
  • Log ini kami ambil berdasarkan UFIBOX Dengan adanya ini gampang-mudahan sanggup membantu mitra-kawan yang ingin melakukan pergantian ic emmc/emcp bisa menjadi lebih mudah.bantu share apabila artikel ini berguna Terima Kasih.
Untuk support ic emmc yang lain mampu menuju kemari,Support ic emmc all merk

Log Info Konfigurasi eMMC/eMCP Advan S50F

  
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Log Info Konfigurasi eMMC/eMCP Advan S50F
Log emmc advan
Manufacturer ID: 0x70 (Kingston)
Product name: V10008 (0x563130303038), rev: 0x06, serial number: 0x03515D2E
Manufacturing date: Aug2019
CID: 70010056 31303030 38060351 5D2E82FE
CSD: D04F0132 0F5903FF FFFFFFEF 8A400060
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.05 GiB(7,566,524,416 bytes)
Partition configuration: 0x08
No boot acknowledge is sent (default)
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID ROM informasi:
platform: sc8830, cpu abi: armeabi-v7a
manufacturer: ADVAN
board: sp7731gea_hd, name: scx35_sp7731geaplus_hd_dt
brand: ADVAN, contoh: S50F
build id: KOT49H, version: 4.4.dua KitKat (S50F_TCS5022B_S100_B1_SP7731_V1.3_20150906)
build description: scx35_sp7731geaplus_hd_dt-user 4.4.dua KOT49H 14B_eng.rc-buildsrv8.20150906.170431 test-keys
Selected: [Kingston] eMMC EMMC08G-V100-C05/8GB  (FBGA153)
  • Log ini di ambil berdasarkan UFIBOX Dengan adanya ini gampang-mudahan sanggup membantu kawan-mitra yang ingin melakukan pergantian ic emmc/emcp mampu menjadi lebih mudah.bantu share bila artikel ini bermanfaat Terima Kasih.
Untuk support emmc lainya mampu menuju kemari Support ic emmc all brand arsip dump emmc advan s50f  sanggup di unduh pada sini,Koleksi file dump emmc advan

Log Info Konfigurasi eMMC/eMCP Samsung Galaxy Active GTI9295

  
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Log Info Konfigurasi eMMC/eMCP Samsung Galaxy Active GT-I9295
Log emmc samsung
Manufacturer ID: 0x15 (Samsung)
Product name: AFEABB (0x414645414242), rev: 0x00, serial number: 0xC40C4685
Manufacturing date: Jun2019
CID: 15010041 46454142 4200C40C 46856052
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01) 
Partition berita:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 512 KiB
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: msm8960, cpu abi: armeabi-v7a
manufacturer: samsung
board: MSM8960, name: jactiveltexx
brand: samsung, contoh: GT-I9295
build id: KOT49H, version: 4.4.2 Lollipop (KOT49H.I9295XXUCNH2)
build description: jactiveltexx-user 4.4.dua KOT49H I9295XXUCNH2 release-keys
Internal storage: 11.89 GiB
  • Log di ambil dari UFIBOX Dengan adanya ini mudah-mudahan bisa membantu mitra-kawan yg ingin melakukan pergantian ic emmc/emcp sanggup sebagai lebih mudah.bantu share bila artikel ini berguna Terima Kasih.
Untuk support emmc lainya bisa menuju kemari Support ic emmc all brand,file arsip dumpnya mampu pada unduh di sini,File dump emmc samsung update

Log Info Konfigurasi eMMC/eMCP Samsung J7 SMJ700F

  
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Log Info Konfigurasi eMMC/eMCP Samsung J7 SM-J700F
Log emmc samsung
Manufacturer ID: 0x11 (Toshiba)
Product name: 400073 (0x343030303733), rev: 0x00, serial number: 0xA84FAF50
Manufacturing date: Jun2019
CID: 11010034 30303037 3300A84F AF5062F9
CSD: D07E0032 0F5903FF FFFFFFE7 8A4000D1
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Capacity: 14.69 GiB(15,770,583,040 bytes)
Partition gosip:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,770,583,040 bytes)
Cache size: 4 MiB
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x11
Power-on write protection: possible
Permanent write protection: not possible
Lock status: locked until next power on
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked

platform: exynos5, cpu abi: armeabi-v7a
manufacturer: samsung
hardware: samsungexynos7580
board: universal7580, name: j7eltexx
brand: samsung, model: SM-J700F
build id: MMB29K, version: 6.0.1 Marshmallow (MMB29K.J700FXXU4BQL1)
build date: Thu Dec  7 16:04:05 KST2019, security patch:2019-08-01
build description: j7eltexx-user 6.0.1 MMB29K J700FXXU4BQL1 release-keys
  • Log ini kami ambil dari UFIBOX Dengan adanya ini mudah-mudahan sanggup membantu mitra-mitra yang ingin melakukan pergantian ic emmc/emcp mampu menjadi lebih gampang.bantu share jika artikel ini berguna Terima Kasih.
Untuk Support emmc lain bisa lanjut disini Support ic emmc all brand File dumpnya disini Koleksi file dump emmc samsung

Tutorial Cara Ganti ic eMMC Redmi Note 4X Mido Langsung ON

  
Tips Blog Mfs
Tutorial Cara Ganti ic eMMC Redmi Note 4X Mido Langsung ON
Tutorial xiaomi
Cara ganti ic emmc redmi note 4x mido.sebelum melangkah dalam tutorial terdapat sedikit yang perlu anda ketahui,yang kami madsut cara ini bukan menggunakan file dump yg eksklusif on melainkan Step by step pada proses pergantian ic emmc dalam redmi note 4x ini bisa berjalan menggunakan semeskinya ( Langsung On ).
Baik kita pribadi saja dimulai menurut persiapan menentukan jenis ic emmc lalu pemilihan arsip dan inti pointya nantinya smartphone mampu balik hayati normal dan mampu balik kesediakala
Memilih Jenis ic eMMC
Dalam hal ini kami menggunakan jenis ic emmc Samsung dengan type KMR310001M-BXXX/16G
Manufacturer ID: 0x15 (Samsung)
Product name: R311MB (0x523331314d42), rev: 0x01, serial number: 0x1558E08F
Manufacturing date: Mar2019
CID: 15010052 3331314D 42011558 E08F32A8
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition berita:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Detected: SAMSUNG moviNAND KMR310001M-BXXX/16G
Dengan kapasitas internal 16gb/ram 2gb,buat yang ingin menggunakan internal 32gb/ram 3gb sanggup menggunakan KMRX1000BM-B614
Manufacturer ID: 0x15 (Samsung)
Product name: RX1BMB (0x525831424d42), rev: 0x07, serial number: 0x75C2CC36
Manufacturing date: Sep2019
CID: 15010052 5831424D 420775C2 CC36932A
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC )
Capacity: 29.13 GiB(31,281,119,232 bytes)
Partition berita:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Dengan kapasitas internal 32gb/Ram 3gb,semua terserah dengan kesukaan dan dana yg terdapat,apabila ingin memakai jenis ic emmc yg lain pula bisa misalnya KMR21 dll,silahkan lanjut disini Support ic emmc all brand.
Mimilih Rom
Dalam memilih versi rom usahakan memakai versi rom terendah dahulu,supaya nanti pada proses perbaikan security nir terlalu repot,pada hal ini kami mengguankan versi miui 8 versi cn,jika berkenan silahkan unduh terlebih dahulu di sini mido_images_V8.lima.6.0.mcfcNED_20170828.0000.00_6.0_cn
Tutorial flashing
Setelah ic emmc sudah ketemu yg cocok silahkan pasang ( Isi kosonangan ) buat memastikan pemasangan sudah benar silahkan lanjut pada sini Cara mengetahui ic emmc telah terpasang dengan sahih.
Kemudian flash,jika nir mempunyai toolbox semisal Ufi mampu memakai Mi flash/ Qpst
Firmware package: mido_images_V8.lima.6.0.mcfcNED_20170828.0000.00_6.0_cn_8705777baf
Scanning for Qualcomm HS-USB QDLoader 9008 device...
Download Port: Qualcomm HS-USB QDLoader 9008 (COM8)
Connection status: EHCI:HUB:HUB:USB 1.16 Full-Speed
USB Driver: [Qualcomm Incorporated] qcusbser, version: 2.1.2.dua, date: 3-25-2016
Initializing...

Processing rawprogram0.xml
Writing PrimaryGPT at 0x00000000 (34 sectors)... Done.
Writing modem at 0x04000000 (172032 sectors)... Done.
Writing sbl1 at 0x0C002400 (721 sectors)... Done.
Writing sbl1bak at 0x0C082400 (721 sectors)... Done.
Writing rpm at 0x0C102400 (341 sectors)... Done.
Writing rpmbak at 0x0C182400 (341 sectors)... Done.
Writing tz at 0x0C202400 (2879 sectors)... Done.
Writing tzbak at 0x0C402400 (2879 sectors)... Done.
Writing devcfg at 0x0C602400 (66 sectors)... Done.
Writing devcfgbak at 0x0C642400 (66 sectors)... Done.
Writing dsp at 0x0C682400 (32768 sectors)... Done.
Writing fsg at 0x10008000 (275 sectors)... Done.
Writing sec at 0x10188000 (1 sectors)... Done.
Writing splash at 0x14000000 (1316 sectors)... Done.
Writing boot at 0x18200000 (46827 sectors)... Done.
Writing system at 0x20300000 (4892736 sectors)... Done.
Writing cache at 0xE4000000 (12497 sectors)... Done.
Writing config at 0xF6180000 (16 sectors)... Done.
Writing lksecapp at 0x110000000 (113 sectors)... Done.
Writing lksecappbak at 0x110020000 (113 sectors)... Done.
Writing cmnlib at 0x110040000 (386 sectors)... Done.
Writing cmnlibbak at 0x110080000 (386 sectors)... Done.
Writing cmnlib64 at 0x1100C0000 (484 sectors)... Done.
Writing cmnlib64bak at 0x110100000 (484 sectors)... Done.
Writing keymaster at 0x110140000 (442 sectors)... Done.
Writing keymasterbak at 0x110180000 (442 sectors)... Done.
Writing cust at 0x114082000 (983323 sectors)... Done.
Writing userdata at 0x148082000 (1139598 sectors)... Done.
Writing BackupGPT at NUM_DISK_SECTORS-33. (33 sectors)... Done.
Applying DISK patch... Done.
Reset power ... Done.
Flashing completed in 4 mins 14.807 s
Setelah flashing selesai,silahkan di hidupkan,sampe di sini harusnya semua sudah normal ya ,tinggal perseteruan imei dan sinyal
ganti%2Bemmc%2Bredmi%2Bnote%2B4x%2Bmido%2Bsukses.png
Redmi note 4x mido
Sekarang kita tinggal repar imei serta jaringan dalam redmi note 4x ini menggunakan memakai metode mode diag,silahkan lanjut di sini Cara masuk dalam mode diag seluruh xiaomi,tentu dengan cara ini kita tidak perlu melakukan root dan sejenisnya,sehabis dalam mode diag tinggal write qcn.filenya bisa pada ambil pada sini,Koleksi semua qcn xiaomi,bagi yg belum paham tentang tata cara write juga read qcn memakai qfil silahkan kemari Cara write serta read qcn memakai qpst/qfil
perbaikan%2Bsinyal%2Bredmi%2Bnote%2B4x%2Bsukses.png
Perbaikan frekuwensi sukses

Kesimpulan
Pada umumnya buat android xiaomi ini banyak sekali emmc yang mendukung,ialah anda mampu melakukan experiment dengan bebas.
Dalam syarat ini rom menggunakan versi cn,tentu tidak ada bahasa indonesia,silahkan flash menggunakan rom global supaya support dengan bahasa indonesia
rom%2Bglobal%2Bredmi%2Bnote%2B4%2Bx.png
Sekian berdasarkan kami,tutorial cara ganti ic emmc redmi note 4x langsung on,jika mengalami masalah tentang seputaran ini? Silahkan tinggalkan pesan dalam kolom komentar.
Selamat mencoba serta Semoga sukses

Cara ganti ic eMMC Xiaomi redmi 3 ido menjadi 16 gb/downgrade memory internal

  
Hai sobat, berjumpa lagi di artikel terbaru dari Tips blog Mfs atau http://tipsblogmfs.blogspot.com dan selamat membaca.
Tutorial kali ini tidak seperti biasa,kami ingin sedikit membuatkan tips cara pergantian ic emmc redmi 3 ido menggunakan bawan storage/memory internl 32 gb plus raam tiga gb ( ic bawaan micron ) menjadi storage/memory internal 16 gb raam 2gb( ic emmc samsung ),merupakan pada sini kami melakukan improvisasi dengan menurunkan speak menurut aslinya,nir misalnya biasa dari sebelum-belumnya kami selalu mengupgrade/menaikan speak device berdasarkan aslinya,karena keterbatasan waktu dan biaya si pemilik smartphone juga telah sepakat akhirnya deal buat melakukan downgrade dalam perangkat hardware ( ic eMMC/Raam ) pada perangkat redmi 3
Cara ganti ic eMMC Xiaomi redmi 3 ido menjadi 16 gb/downgrade ( memory internal )
Tutorial xiaomi
Lanjut ke inti utama,baik pada hal ini kami memakai jenis ic emmc samsung menggunakan type KMR310001M-BXXX/16G  buat yg ingin menggunakan jenis ic emmc lain bisa lihat di sini
dalam proses pengisian data ic emmc kami tidak memakai arsip dump,melainkan memakai firmware biasa madsut kami firmware yang biasa pada pakai saat flashing menggunakan miflash,cuman bedanya di sini kami menggunakan Ufibox menggunakan cara ic emmc tidak lengket dalam board dalam mesin,melainkan pada socket box ic emmc
IMG_1285.jpg
setelah ic emmc di isi data melalui factory image  lanjut pasang
Cara ganti ic eMMC Xiaomi redmi 3 ido menjadi 16 gb/downgrade ( memory internal )
Log:
Power supply: dual-voltage (1.70-1.95V, dua.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: R311MB (0x523331314d42), rev: 0x01, serial number: 0x8D47EEF0
Manufacturing date: May2019
CID: 15010052 3331314D 42018D47 EEF0521A
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)

Processing file: "gpt_backup0.bin"... Skipped
Processing file: "gpt_main0.bin"...
Applying patch: Update last partition 31 'userdata' with actual size in Primary Header....done.
Applying patch: Update Primary Header with LastUseableLBA....done.
Applying patch: Update Primary Header with BackupGPT Header Location....done.
Applying patch: Update Primary Header with CRC of Partition Array....done.
Applying patch: Zero Out Header CRC in Primary Header....done.
Applying patch: Update Primary Header with CRC of Primary Header....done.
Writing PrimaryGPT at 0x00000000 (34 sectors)... Done in 0.004 s
Processing file: "NON-HLOS.bin"...
Writing modem at 0x04000000 (106691 sectors)... Done in 5.677 s
Processing arsip: "sbl1.mbn"...
Writing sbl1 at 0x08000000 (573 sectors)... Done in 0.027 s
Processing arsip: "sbl1.mbn"...
Writing sbl1bak at 0x08080000 (573 sectors)... Done in 0.028 s
Processing file: "emmc_appsboot.mbn"...
Writing aboot at 0x08100000 (1036 sectors)... Done in 0.051 s
Processing file: "emmc_appsboot.mbn"...
Writing abootbak at 0x08200000 (1036 sectors)... Done in 0.049 s
Processing file: "rpm.mbn"...
Writing rpm at 0x08300000 (313 sectors)... Done in 0.016 s
Processing file: "rpm.mbn"...
Writing rpmbak at 0x08380000 (313 sectors)... Done in 0.016 s
Processing arsip: "tz.mbn"...
Writing tz at 0x08400000 (1010 sectors)... Done in 0.075 s
Processing arsip: "tz.mbn"...
Writing tzbak at 0x08480000 (1010 sectors)... Done in 0.048 s
Processing file: "hyp.mbn"...
Writing hyp at 0x08500000 (144 sectors)... Done in 0.007 s
Processing file: "hyp.mbn"...
Writing hypbak at 0x08580000 (144 sectors)... Done in 0.008 s
Processing file: "boot.img"...
Writing boot at 0x0C18C000 (18575 sectors)... Done in 0.881 s
Processing arsip: "system.img"...
Unsparsing image... Done.
Writing system at 0x0E18C000 (4194048 sectors)... Done in tiga mins 18.333 s
Processing arsip: "persist.img"...
Unsparsing image... Done.
Writing persist at 0x9E18C000 (65536 sectors)... Done in 3.095 s
Processing arsip: "cache.img"...
Unsparsing image... Done.
Writing cache at 0xA018C000 (536576 sectors)... Done in 25.531 s
Processing arsip: "recovery.img"...
Writing recovery at 0xB078C000 (20131 sectors)... Done in 0.997 s
Processing arsip: "cust.img"...
Unsparsing image... Done.
Writing cust at 0xB8088000 (1048576 sectors)... Done in 49.840 s
Processing file: "userdata.img"...
Unsparsing image... Done.
Writing userdata at 0xDC000000 (22017696 sectors)... Done in 17 mins 41.902 s
Setting boot config...
Writing boot partition config to 0x38... Done.

VCC: tiga.tiga V, VCCQ: dua.8 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, dua.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: R311MB (0x523331314d42), rev: 0x01, serial number: 0x8D47EEF0
Manufacturing date: May2019
CID: 15010052 3331314D 42018D47 EEF0521A
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID ROM isu:
platform: msm8916, cpu abi: arm64-v8a
manufacturer: Xiaomi
board: msm8916, name: ido
brand: Xiaomi, model: Redmi 3
build id: LMY47V, version: 5.1.1 Lollipop (LMY47V)
build description: ido-user lima.1.1 LMY47V V7.5.dua.0.laicNDE release-keys

Internal storage: 10.50 GiB
crypto state: unencrypted
Detected: SAMSUNG moviNAND KMR310001M-BXXX/16G
bagi yg belum punya firmwarenya mampu pada download pada sini
Silahkan di pilih sinkron kebutuhan,kalo pemasangan sudah bener serta nir ada ganguan lain,seharusnya smartphone sudah bisa hidup
IMG_1248.jpg
tentu dalam kondisi ini imei bermasalah ( nir valid ) jadi kita harus melakukan perbaikan imei ( request unlock bootloader) cara ini sebenarnya relatif repot,jadi buwat yg gak mau report sanggup menggunakan file dump ini
File di atas support buat jenis ic emmc yang berkapasitas 32gb bukan pada peruntukan yang berkapasitas 16g,arsip eksklusif on.mungkin menggunakan cari ini kita tidak repot buat kasus pemugaran frekuwensi,pada dasarnya arsip beliau atas tinggal bayaranlah hehe.uang rokkok ingat hahaha..
Mungkin itu dulu yang bisa kami bagikan cara downgrade memory internal redmi tiga menjadi 16gb,semoga bisa membantu buwat kawan-mitra yg ingin melakukan downgrade ( memory internal ) pada redmi 3
Cara ganti ic eMMC Xiaomi redmi 3 ido menjadi 16 gb/downgrade ( memory internal )
Semoga sukses

Log Info Konfigurasi ic eMMC/eMCP Lenovo VIBE SHOT Z90a40

  
Tips Blog Mfs - welcome back to http://tipsblogmfs.blogspot.com
Log Info Konfigurasi ic eMMC/eMCP Lenovo VIBE SHOT Z90a40
Log emmc lenovo
Manufacturer ID: 0x15 (Samsung)
Product name: R21BMB (0x523231424d42), rev: 0x06, serial number: 0x0546D4AF
Manufacturing date: Jun2019
CID: 15010052 3231424D 42060546 D4AF6200
CSD: D0270132 0F5903FF F6DBFFEF 8E404000
EXT_CSD revision: 1.7 (MMC v5.0, v5.01) 
Capacity: 29.13 GiB(31,281,119,232 bytes)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,281,119,232 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

platform: msm8916, cpu abi: arm64-v8a
manufacturer: LENOVO
hardware: qcom
board: msm8916, name: zoom_row
brand: Lenovo, contoh: Lenovo Z90a40
build id: LMY47O, version: lima.1 Lollipop (Z90a40_S240_160119_ROW)
build date: Tue Jan 19 17:48:40 CST2019, security patch:2019-12-01
build description: zoom_row-user lima.1 LMY47O Z90a40_S240_160119_ROW release-keys
  • Log ini kami ambil dari UFIBOX Dengan adanya ini gampang-mudahan sanggup membantu mitra-kawan yg ingin melakukan pergantian ic emmc/emcp mampu sebagai lebih gampang.bantu share jika artikel ini berguna Terima Kasih.
Download Firmware / Stock ROM Asus Zenfone 2 Laser ZE600KL All Versions

Download Firmware / Stock ROM Asus Zenfone 2 Laser ZE600KL All Versions

  
Download Firmware ASUS Zenfone 2 Laser (ZE600KL)

Firmware is a software that is attached to a mini media memory on a hardware device that consists of the identification and practical hardware. On Smartphone or Tablet Android devices in general often experience problems in Firmware such as Bootloop, Brick, Stuck on Logo, Hang or maybe caught on Google FRP.

Usually users who revel in the hassle have to do Flashing Firmware / Stock ROM to fix problems that are happening on their Smartphone or Tablet, in the hope after doing Flashing Firmware / Stock ROM is their Android Device will return to normal. Flashing the new Firmware does not rule out the possibility that your Android device will return to normal or even exacerbate the problem. Flashing Also done to update the Android system or upgrade from the Android system.

To perform Flashing Firmware / Stock ROM Asus Zenfone 2 Laser (ZE600KL) there are Four ways, based on the type of Firmware Format and Smartphone Chipset used, Flashing Firmware Asus Zenfone 2 Laser (ZE600KL) is done with some Tool, Using ADB and Fastboot Tool, ASUS Flash Tool, QPST Flash Tool (Qualcomm Product Support Tool ) and SPFT (SmartPhone Flash Tool).

ADB and Fastboot Tool are used if you find the Asus Zenfone 2 Laser (ZE600KL) Firmware in the form of .img documents like "boot.img, fastboot.img, recovery.img" and so forth which might be extracted from ZIP or RAW files, and also used for Flashing Firmware OTA update (example: UL-ASUS_Z007-WW-4.11.40.179-consumer.zip) acquired from Asus Official website //www.asus.com, ADB and Fastboot Tool are standard, unconditional to Asus Zenfone Smartphone the use of Chipset positive. While the ASUS Flash Tool is used to perform Flashing Firmware to a special Asus Zenfone 2 Laser (ZE600KL) that uses INTEL Chipset and usually with Format Firmware .raw or RAW format this is compressed inside the shape of .ZIP. QPST Flash Tool is used to Flashing Firmware to a special Asus Zenfone 2 Laser (ZE600KL) that uses Qualcomm Chipset (mbn). SPFT Flash Tool is used to Flashing Firmware to a special Asus Zenfone 2 Laser (ZE600KL) that uses Mediatek Chipset (MTK).

To be able to do Flashing Firmware Asus Zenfone 2 Laser (ZE600KL), then you need Firmware / Stock ROM files that fit the device, if not suitable then most likely Android device will experience problems, so be careful in choosing Firmware / Stock ROM file you want Flash.

In this post we want to share to you who need Firmware / Stock ROM Asus Zenfone 2 Laser (ZE600KL) for the purposes of fixing the problem of Smartphone or Android Tablet device in the first paragraph.

If you want other RAW Firmware ASUS Android Devices, then you may get it on the Download Firmware RAW ASUS (All Models) and for ASUS Stock ROM, you may get it on the submit of Download Stock ROM ASUS Zenfone (All Models).
Below is Firmware / Stock ROM Asus Zenfone 2 Laser (ZE600KL) which you can download and make sure Firmware / Stock ROM is in accordance with the Asus Zenfone 2 Laser (ZE600KL) device you have.

WW_ZE600KL_1.11.40.396_20150909125321-secured-release_QC.zip 1.6 GB

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