Tutorial kali ini tidak seperti biasa,kami ingin sedikit membuatkan tips cara pergantian ic emmc redmi 3 ido menggunakan bawan storage/memory internl 32 gb plus raam tiga gb ( ic bawaan micron ) menjadi storage/memory internal 16 gb raam 2gb( ic emmc samsung ),merupakan pada sini kami melakukan improvisasi dengan menurunkan speak menurut aslinya,nir misalnya biasa dari sebelum-belumnya kami selalu mengupgrade/menaikan speak device berdasarkan aslinya,karena keterbatasan waktu dan biaya si pemilik smartphone juga telah sepakat akhirnya deal buat melakukan downgrade dalam perangkat hardware ( ic eMMC/Raam ) pada perangkat redmi 3
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| Tutorial xiaomi |
dalam proses pengisian data ic emmc kami tidak memakai arsip dump,melainkan memakai firmware biasa madsut kami firmware yang biasa pada pakai saat flashing menggunakan miflash,cuman bedanya di sini kami menggunakan Ufibox menggunakan cara ic emmc tidak lengket dalam board dalam mesin,melainkan pada socket box ic emmc
Power supply: dual-voltage (1.70-1.95V, dua.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: R311MB (0x523331314d42), rev: 0x01, serial number: 0x8D47EEF0
Manufacturing date: May2019
CID: 15010052 3331314D 42018D47 EEF0521A
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Processing file: "gpt_backup0.bin"... Skipped
Processing file: "gpt_main0.bin"...
Applying patch: Update last partition 31 'userdata' with actual size in Primary Header....done.
Applying patch: Update Primary Header with LastUseableLBA....done.
Applying patch: Update Primary Header with BackupGPT Header Location....done.
Applying patch: Update Primary Header with CRC of Partition Array....done.
Applying patch: Zero Out Header CRC in Primary Header....done.
Applying patch: Update Primary Header with CRC of Primary Header....done.
Writing PrimaryGPT at 0x00000000 (34 sectors)... Done in 0.004 s
Processing file: "NON-HLOS.bin"...
Writing modem at 0x04000000 (106691 sectors)... Done in 5.677 s
Processing arsip: "sbl1.mbn"...
Writing sbl1 at 0x08000000 (573 sectors)... Done in 0.027 s
Processing arsip: "sbl1.mbn"...
Writing sbl1bak at 0x08080000 (573 sectors)... Done in 0.028 s
Processing file: "emmc_appsboot.mbn"...
Writing aboot at 0x08100000 (1036 sectors)... Done in 0.051 s
Processing file: "emmc_appsboot.mbn"...
Writing abootbak at 0x08200000 (1036 sectors)... Done in 0.049 s
Processing file: "rpm.mbn"...
Writing rpm at 0x08300000 (313 sectors)... Done in 0.016 s
Processing file: "rpm.mbn"...
Writing rpmbak at 0x08380000 (313 sectors)... Done in 0.016 s
Processing arsip: "tz.mbn"...
Writing tz at 0x08400000 (1010 sectors)... Done in 0.075 s
Processing arsip: "tz.mbn"...
Writing tzbak at 0x08480000 (1010 sectors)... Done in 0.048 s
Processing file: "hyp.mbn"...
Writing hyp at 0x08500000 (144 sectors)... Done in 0.007 s
Processing file: "hyp.mbn"...
Writing hypbak at 0x08580000 (144 sectors)... Done in 0.008 s
Processing file: "boot.img"...
Writing boot at 0x0C18C000 (18575 sectors)... Done in 0.881 s
Processing arsip: "system.img"...
Unsparsing image... Done.
Writing system at 0x0E18C000 (4194048 sectors)... Done in tiga mins 18.333 s
Processing arsip: "persist.img"...
Unsparsing image... Done.
Writing persist at 0x9E18C000 (65536 sectors)... Done in 3.095 s
Processing arsip: "cache.img"...
Unsparsing image... Done.
Writing cache at 0xA018C000 (536576 sectors)... Done in 25.531 s
Processing arsip: "recovery.img"...
Writing recovery at 0xB078C000 (20131 sectors)... Done in 0.997 s
Processing arsip: "cust.img"...
Unsparsing image... Done.
Writing cust at 0xB8088000 (1048576 sectors)... Done in 49.840 s
Processing file: "userdata.img"...
Unsparsing image... Done.
Writing userdata at 0xDC000000 (22017696 sectors)... Done in 17 mins 41.902 s
Setting boot config...
Writing boot partition config to 0x38... Done.
VCC: tiga.tiga V, VCCQ: dua.8 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, dua.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: R311MB (0x523331314d42), rev: 0x01, serial number: 0x8D47EEF0
Manufacturing date: May2019
CID: 15010052 3331314D 42018D47 EEF0521A
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition informasi:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID ROM isu:
platform: msm8916, cpu abi: arm64-v8a
manufacturer: Xiaomi
board: msm8916, name: ido
brand: Xiaomi, model: Redmi 3
build id: LMY47V, version: 5.1.1 Lollipop (LMY47V)
build description: ido-user lima.1.1 LMY47V V7.5.dua.0.laicNDE release-keys
Internal storage: 10.50 GiB
crypto state: unencrypted
Detected: SAMSUNG moviNAND KMR310001M-BXXX/16G
bagi yg belum punya firmwarenya mampu pada download pada sini
Silahkan di pilih sinkron kebutuhan,kalo pemasangan sudah bener serta nir ada ganguan lain,seharusnya smartphone sudah bisa hidup
File di atas support buat jenis ic emmc yang berkapasitas 32gb bukan pada peruntukan yang berkapasitas 16g,arsip eksklusif on.mungkin menggunakan cari ini kita tidak repot buat kasus pemugaran frekuwensi,pada dasarnya arsip beliau atas tinggal bayaranlah hehe.uang rokkok ingat hahaha..
Mungkin itu dulu yang bisa kami bagikan cara downgrade memory internal redmi tiga menjadi 16gb,semoga bisa membantu buwat kawan-mitra yg ingin melakukan downgrade ( memory internal ) pada redmi 3
